• REFLOW TIN PLATING, HOT-DIP TIN PLATING

  • Details
  • PRODUCTINTRODUCTION

    Substrate: Various copper and copper alloy strips

    Substrate thickness:0.1-0.8mm

    Substrate width:8-380mm

    PRODUCTPERFORMANCE:

    Environmental protection, lead-free, good solderability, highcorrosion resistance, good metal adhesion.

    APPLICATION SCOPE:

    Automotive industry,relays,sensors,communicationsmedical and other industries.

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